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2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Package Dimensions
Figure 16: 216-Ball FBGA – 12mm x 12mm (Package Code KJ)
Seating plane
216X ?0.27
Dimensions
A
0.08 A
apply to solder
balls post-reflow
Pin A1 index
Pin A1 index
on ?0.24 SMD ball
pads.
28 26 24 22 20 18 16 14 12 10
29 27 25 23 21 19 17 15 13 11 9
8
7
6
5
4
3
2
1
11.2 CTR
12 ±0.1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
0.4 TYP
Notes:
0.4 TYP
11.2 CTR
12 ±0.1
1. All dimensions are in millimeters.
0.9 ±0.1
0.155 MIN
2. Solder ball material: SAC105 (98.5% Sn, 1% Ag, 0.5% Cu).
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
29
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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